首页> 外文期刊>Applied Physics Letters >Improved read disturb and write error rates in voltage-control spintronics memory (VoCSM) by controlling energy barrier height
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Improved read disturb and write error rates in voltage-control spintronics memory (VoCSM) by controlling energy barrier height

机译:通过控制能垒高度,改善了电压控制自旋电子学存储器(VoCSM)中的读取干扰和写入错误率

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摘要

A hybrid writing scheme that combines the spin Hall effect and voltage-controlled magnetic-anisot-ropy effect is investigated in Ta/CoFeB/MgO/CoFeB/Ru/CoFe/IrMn junctions. The write current and control voltage are applied to Ta and CoFeB/MgO/CoFeB junctions, respectively. The critical current density required for switching the magnetization in CoFeB was modulated 3.6-fold by changing the control voltage from - 1.0 V to+l.OV. This modulation of the write current density is explained by the change in the surface anisotropy of the free layer from 1.7 mJ/m~2 to 1.6 mJ/m~2, which is caused by the electric field applied to the junction. The read disturb rate and write error rate, which are important performance parameters for memory applications, are drastically improved, and no error was detected in 5 × 10~8 cycles by controlling read and write sequences.
机译:在Ta / CoFeB / MgO / CoFeB / Ru / CoFe / IrMn结中研究了一种结合了自旋霍尔效应和电压控制的磁-尼罗普效应的混合写入方案。写入电流和控制电压分别施加到Ta和CoFeB / MgO / CoFeB结。通过将控制电压从-1.0 V更改为+ 1.0V,将切换CoFeB中的磁化所需的临界电流密度调节了3.6倍。写电流密度的这种调制通过自由层的表面各向异性从1.7 mJ / m〜2到1.6 mJ / m〜2的变化来解释,这是由施加到结的电场引起的。显着提高了读取干扰率和写入错误率,这是存储器应用程序的重要性能参数,并且通过控制读取和写入序列,在5×10〜8个周期内未检测到错误。

著录项

  • 来源
    《Applied Physics Letters》 |2017年第25期|111-114|共4页
  • 作者单位

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

    Corporate R&D Center, Toshiba Corporation, Kawasaki 212-8582, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    252404.1-252404.4;

    机译:252404.1-252404.4;

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