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Control of carrier lifetime of thick n-type 4H-SiC epilayers by high-temperature Ar annealing

机译:通过高温Ar退火控制厚n型4H-SiC外延层的载流子寿命

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摘要

We investigated the carrier lifetime and Z(1/2) center density of thick n-type 4H-SiC epilayers, which were oxidized and subsequently annealed in Ar at high temperatures. The Z(1/2) center density decreased below the detection limit in the region to, at least, a 130 mu m depth by thermal oxidation. After subsequent high-temperature annealing, the Z(1/2) center density increased with increasing annealing temperature, while the distribution of the Z(1/2) center density was nearly uniform to a 130 mu m depth. The carrier lifetime could be controlled from 26 to 2.4 mu by changing the annealing temperature from 1600 to 1800 degrees C. (C) 2016 The Japan Society of Applied Physics
机译:我们研究了厚的n型4H-SiC外延层的载流子寿命和Z(1/2)中心密度,该层被氧化并随后在Ar中于高温下退火。通过热氧化,Z(1/2)中心密度在该区域内降至检测极限以下,至少达到130μm的深度。在随后的高温退火之后,Z(1/2)中心密度随退火温度的升高而增加,而Z(1/2)中心密度的分布几乎均匀到130μm的深度。通过将退火温度从1600摄氏度更改为1800摄氏度,可以将载流子寿命控制在26到2.4微米之间。(C)2016日本应用物理学会

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  • 来源
    《Applied physics express》 |2016年第6期|061303.1-061303.3|共3页
  • 作者单位

    Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6158510, Japan;

    Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6158510, Japan;

    Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6158510, Japan;

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