首页> 外文期刊>IEEE Antennas and Wireless Propagation Letters >Wideband Dipole Array Loaded Substrate-Integrated Horn Array With Improved Sidelobe Performance
【24h】

Wideband Dipole Array Loaded Substrate-Integrated Horn Array With Improved Sidelobe Performance

机译:具有改善的旁瓣性能的宽带偶极阵列加载的基片集成喇叭阵列

获取原文
获取原文并翻译 | 示例

摘要

In this letter, a novel millimeter-wave substrate-integrated H-plane horn array is presented by combining a loaded dipole array and the gap substrate-integrated waveguide consisting of eight etched slits. The operating mechanism and design process of the array are investigated. A wide impedance bandwidth of 33%, a gain up to 14.6 dBi, and symmetrical radiation patterns with cross polarizations of less than -23 dB are verified experimentally by a 1 x 4 fabricated prototype. An improved sidelobe level of almost less than -10 dB is also achieved over the wideband even though the element spacing of the array is larger than two operating wavelengths. The proposed method is valuable for the realization of wideband high-gain planar horn arrays with large element spacing, which is an attractive candidate for millimeter-wave applications.
机译:在这封信中,通过结合负载偶极子阵列和由八个蚀刻缝隙组成的间隙基板集成波导,提出了一种新型毫米波基板集成H平面喇叭阵列。研究了阵列的工作机理和设计过程。 1 x 4制作的原型机通过实验验证了33%的宽阻抗带宽,高达14.6 dBi的增益以及交叉极化小于-23 dB的对称辐射图。即使阵列的元件间距大于两个工作波长,也能在宽带上获得几乎低于-10 dB的改进旁瓣电平。所提出的方法对于实现具有大元件间距的宽带高增益平面喇叭阵列具有重要价值,这对于毫米波应用是有吸引力的候选者。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号