首页> 外文期刊>Antennas and Propagation, IEEE Transactions on >A Broadband Impedance Matching Method for Proximity-Coupled Microstrip Antenna
【24h】

A Broadband Impedance Matching Method for Proximity-Coupled Microstrip Antenna

机译:邻近耦合微带天线的宽带阻抗匹配方法

获取原文

摘要

In a proximity-coupled microstrip antenna, when a laminate used is too thick for the antenna layer, the coupling will be decreased. And it is hard to achieve broadband impedance matching. The authors present a method to optimize impedance matching through narrow cavity backed configuration. A prototype antenna is designed with this method and fabricated. Simulation and measurement results indicate that the bandwidth of the antenna exceeds 40% $({rm VSWR}u0003C;2.0)$. The antenna has a larger effective coupling as compared with the conventional proximity-coupled antenna without the narrow cavity backed configuration. It is easier to enhance the bandwidth with a thicker laminate. Meanwhile, this antenna is benefit for manufacturing and assembling to an array due to its simple configuration.
机译:在接近耦合微带天线中,当所使用的层压板对于天线层而言太厚时,耦合将降低。而且很难实现宽带阻抗匹配。作者提出了一种通过窄腔背衬配置优化阻抗匹配的方法。用这种方法设计并制造了原型天线。仿真和测量结果表明,天线带宽超过40%({rm VSWR} u0003C; 2.0)$。与没有窄腔背衬结构的常规接近耦合天线相比,该天线具有更大的有效耦合。使用较厚的层压板更容易提高带宽。同时,这种天线由于其简单的构造而有利于制造和组装成阵列。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号