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Low-Cost Aperture-Coupled 60-GHz-Phased Array Antenna Package With Compact Matching Network

机译:具有紧凑匹配网络的低成本光圈耦合60 GHz相控阵天线封装

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A low-cost multilayer antenna-in-package solution, using the standard printed-circuit-board (PCB) process, is proposed for the 60-GHz-phased array system. The design procedure focuses on overcoming the fabrication restrictions and realizing a low-cost, broadband, compact and reliable package solution. The multilayer stack-up structure consists of three laminates and two bondply layers, with which the antenna element, vertical quasi-coaxial via transition, antenna feedline, power, and low-speed interfaces are realized. An aperture-coupled patch antenna with a compact fan-shaped feeding network and a vertical quasi-coaxial via transition are proposed, fabricated, and measured. For the single antenna element, including the vertical quasi-coaxial via transition, the measured fractional impedance bandwidth (|S11| <; -10 dB) is 20.2%, and the measured peak gain is 6.9 dBi at 62 GHz. Based on the single antenna, a 16-element antenna package is realized in the dimension of 14 mm × 14 mm × 0.925 mm. Measurements show that each antenna element achieves a |S11| less than -10 dB from 57.2 to 64.5 GHz, 4-7.5 dBi gain across all four IEEE 802.15.3c channels.
机译:针对60 GHz相控阵系统,提出了一种采用标准印刷电路板(PCB)工艺的低成本多层封装天线解决方案。设计过程着重于克服制造限制并实现低成本,宽带,紧凑而可靠的封装解决方案。多层堆叠结构由三个层压板和两个粘合层组成,通过它们可以实现天线元件,垂直准同轴通孔过渡,天线馈线,电源和低速接口。提出,制造并测量了具有紧凑的扇形馈电网络和垂直准同轴通孔过渡的孔径耦合贴片天线。对于包括垂直准同轴通孔过渡的单个天线元件,测得的部分阻抗带宽(| S11 | <; -10 dB)为20.2%,测得的峰值增益在62 GHz下为6.9 dBi。基于单天线,可实现尺寸为14 mm×14 mm×0.925 mm的16元素天线封装。测量表明,每个天线元件均达到| S11 |。从57.2至64.5 GHz小于-10 dB,在所有四个IEEE 802.15.3c通道上的增益为4-7.5 dBi。

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