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Cofiring kinetics and mechanisms of an Ag-metallized ceramic-filled glass electronic package

机译:银金属化陶瓷填充玻璃电子封装的共烧动力学和机理

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摘要

Cofiring kinetics and mechanisms of an Ag-based ceramic- filled glass packaging system have been investigated. Boundary diffusion controlled solid-state sintering is iden- Tified as the controlling densification mechanism of the Ag Film. For ceramic-filled glass tape, which is a mixture of Glass and ceramic powders, the sintering kinetics are con- Trolled by the viscous flow of low-softening-point glass.
机译:已经研究了基于Ag的陶瓷填充玻璃包装系统的共烧动力学和机理。边界扩散控制的固态烧结被确定为Ag薄膜的控制致密化机理。对于由玻璃和陶瓷粉末组成的陶瓷填充玻璃带,其烧结动力学受低软化点玻璃的粘性流的控制。

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