Acoustic Micro Imaging of Gold-gold MEMS Wafer Bonds

摘要

The metal-to-metal thermo-compres-sion wafer bonding technique being developed for this MEMS application may be useful for applications outside of MEMS manufacturing. Wafers can also be bonded using deposited copper in place of gold. Copper thermo-compres-sion bonding can be used to join to two integrated circuit wafers to realize 3D-ICs. Copper-to-copper bonding is desirable for 3D-ICs as the bond can serve as both the mechanical and electrical interconnect between the two devices.