Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects

摘要

This paper addresses the problem of scaling interconnects to nanometric dimensions in future very-large-scale integration applications. Traditional copper interconnects are compared to innovative interconnects made by bundles of metallic carbon nanotubes. A new model is presented to describe the propagation of electric signals along carbon nanotube (CNT) bundles, in the framework of the classical transmission line theory. A possible implementation of a future scaled microstrip based on CNT bundle is analyzed and compared to a conventional microstrip.