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Ultrathin Silicon Circuits With Strain-Isolation Layers and Mesh Layouts for High-Performance Electronics on Fabric, Vinyl, Leather, and Paper

机译:具有应变隔离层和网格布局的超薄硅电路,用于织物,乙烯基,皮革和纸张上的高性能电子产品

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摘要

Electronic systems built on plastic sheets, metal foils, rubber slabs and other unusual substrates have great potential for use in conformal image sensors, flexible displays, biomedical devices and other emerging applications. Research in this area includes the development of organic conductors and semiconductors materials whose excellent mechanical flexibility and low temperature processability are attractive for these systems.
机译:在塑料片,金属箔,橡胶板和其他特殊基材上构建的电子系统具有巨大的潜力,可用于保形图像传感器,柔性显示器,生物医学设备和其他新兴应用中。该领域的研究包括有机导体和半导体材料的开发,其优异的机械柔韧性和低温加工性能对于这些系统具有吸引力。

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  • 来源
    《Advanced Materials》 |2009年第36期|3703-3707|共5页
  • 作者单位

    Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);

    Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);

    Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA);

    Institute of High Performance Computing 1 Fusionopolis Way, #16-16 Connexis 138632 Singapore (Singapore);

    Department of Mechanical and Aerospace Engineering University of Miami Coral Gables, FL 33146 (USA);

    Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);

    Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA);

    FML, Departments of Engineering Mechanics Tsinghua University Beijing, 100084 (P. R. China);

    Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Chemistry Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Mechanical Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);

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