机译:具有应变隔离层和网格布局的超薄硅电路,用于织物,乙烯基,皮革和纸张上的高性能电子产品
Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);
Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);
Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA);
Institute of High Performance Computing 1 Fusionopolis Way, #16-16 Connexis 138632 Singapore (Singapore);
Department of Mechanical and Aerospace Engineering University of Miami Coral Gables, FL 33146 (USA);
Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);
Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA);
FML, Departments of Engineering Mechanics Tsinghua University Beijing, 100084 (P. R. China);
Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Chemistry Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Mechanical Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA);
机译:通过在柔性印刷电路中旋转啮合地面,通过旋转啮合的地面来减轻差分歪斜
机译:在氧化硅表面上的噻吩/亚苯基共聚体超薄层的传导带电子状态
机译:超薄水解的动力学和化学,氧化硅的热生长层作为柔性电子系统生物流体屏障
机译:可伸展的硅电子及其与橡胶,塑料,纸,乙烯基,皮革和织物基材的整合
机译:硅衬底上二氧化硅超薄层的励磁诱导应力研究
机译:热生长二氧化硅的超薄转移层作为生物集成柔性电子系统的生物流体屏障
机译:超薄水解的动力学和化学,氧化硅的热生长层作为柔性电子系统中的生物流体屏障