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首页> 外文期刊>Advanced Materials >Local Defects in Colloidal Quantum Dot Thin Films Measured via Spatially Resolved Multi-Modal Optoelectronic Spectroscopy
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Local Defects in Colloidal Quantum Dot Thin Films Measured via Spatially Resolved Multi-Modal Optoelectronic Spectroscopy

机译:通过空间分辨多模态光电光谱法测量的胶体量子点薄膜中的局部缺陷

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摘要

The morphology, chemical composition, and electronic uniformity of thin-film solution-processed optoelectronics are believed to greatly affect device performance. Although scanning probe microscopies can address variations on the micrometer scale, the field of view is still limited to well under the typical device area, as well as the size of extrinsic defects introduced during fabrication. Herein, a micrometer-resolution 2D characterization method with millimeter-scale field of view is demonstrated, which simultaneously collects photoluminescence spectra, photocurrent transients, and photovoltage transients. This high-resolution morphology mapping is used to quantify the distribution and strength of the local optoelectronic property variations in colloidal quantum dot solar cells due to film defects, physical damage, and contaminants across nearly the entire test device area, and the extent to which these variations account for overall performance losses. It is found that macroscopic defects have effects that are confined to their localized areas, rarely prove fatal for device performance, and are largely not responsible for device shunting. Moreover, quantitative analysis based on statistical partitioning methods of such data is used to show how defect identification can be automated while identifying variations in underlying properties such as mobilities and recombination strengths and the mechanisms by which they govern device behavior.
机译:薄膜溶液处理的光电器件的形态,化学成分和电子均匀性被认为会极大地影响器件性能。尽管扫描探针显微镜可以解决微米级的变化,但视野仍然局限于典型的器件区域以及制造过程中引入的外部缺陷的大小。本文介绍了一种具有毫米级视场的微米级分辨率二维表征方法,该方法同时收集了光致发光光谱,光电流瞬变和光电压瞬变。这种高分辨率的形态映射用于量化胶体量子点太阳能电池中由于膜缺陷,物理损坏和几乎整个测试设备区域中的污染物所致的局部光电性能变化的分布和强度,以及这些程度变化会造成整体性能损失。已经发现,宏观缺陷的作用仅限于其局部区域,很少证明对设备性能具有致命性,并且在很大程度上不负责器件分流。此外,基于此类数据的统计划分方法的定量分析用于显示如何在识别潜在属性(如迁移率和重组强度)以及它们控制设备行为的机制方面的变化的同时,自动进行缺陷识别。

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