The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid–solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond particles. The diamond content decreases along a gradient from the bottom of the shell, which houses the chips, to the top of the shell wall, which is welded with the cover plate. The bottom of the shell has a thermal conductivity (TC) of 169 W/mK, coefficient of thermal expansion (CTE) of 11.0 × 10−6/K, bending strength of 88 MPa, and diamond content of 48 vol.%. The top of the shell has a TC of 108 W/mK, CTE of 19.3 × 10−6/K, bending strength of 175 MPa, and diamond content of 15 vol.%, which solves the special requirements of different parts of the shell and helps to improve the thermal stability of packaging components. Moreover, the interfacial characteristics are also investigated. This work provides a promising approach for the preparation of packaging shells by near-net shape forming.
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机译：电子封装壳中，为了大微电子器件芯片的密封封装了必要的物质，是通过均匀的块的机械加工制成。然而，在外壳的不同位置，由于性能属性多种需求还没有得到解决。一个独立开发的液 - 固分离技术应用到制造金刚石/ Al复合材料具有金刚石颗粒的分级分布。金刚石含量沿从壳体的底部，其容纳的芯片，与所述外壳壁，其被焊接与盖板的顶部的梯度减小。壳的底部具有169 W / mk，热膨胀系数（CTE）为11.0×10-6 / K的热导率（TC），弯曲88兆帕的强度，以及48体积％的金刚石含量。外壳的顶部具有108 W / mK的，CTE的一个TC 19.3×10-6 / K，弯曲175兆帕的强度，以及15体积％的金刚石含量，这解决了外壳的不同部分的特殊要求并有助于提高包装组件的热稳定性。此外，界面特性也被调查。这项工作提供了一种通过近净形成形的制剂包装壳的有前途的方法。
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