采用化学镀法在纯铜基体上镀上镍−磷镀层，并通过液固复合铸造工艺制备 Al/Cu 双金属材料。研究不同工艺参数(结合温度、预热时间)下 Al/Cu 接头的显微组织、力学性能和导电性能。结果表明，各种金属间化合物在界面处形成，其厚度和种类随结合温度和预热时间的增加而增加。Ni−P 夹层发挥了扩散阻碍层和保护膜的作用，有效地减少了金属间化合物的形成。Al/Cu 双金属复合材料的剪切强度和电导率随金属间化合物厚度的增加而减小，特别地，Al2Cu 相的不利影响相比其他金属间化合物更加明显。在780°C 预热150 s 条件下制备的试样表现出最大的剪切强度和电导率，其值分别为49.8 MPa 和5.29×105 S/cm。%A Ni−P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid−liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters (bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni−P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 °C for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×105 S/cm, respectively.
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