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Flexibility of Fluorinated Graphene-Based Materials

机译:氟化石墨烯基材料的柔韧性

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摘要

The resistivity of different films and structures containing fluorinated graphene (FG) flakes and chemical vapor deposition (CVD)-grown graphene of various fluorination degrees under tensile and compressive strains due to bending deformations was studied. Graphene and multilayer graphene films grown by means of the chemical vapor deposition (CVD) method were transferred onto the flexible substrate by laminating and were subjected to fluorination. They demonstrated a weak fluorination degree (F/C lower 20%). Compressive strains led to a strong (one-two orders of magnitude) decrease in the resistivity in both cases, which was most likely connected with the formation of additional conductive paths through fluorinated graphene. Tensile strain up to 3% caused by the bending of both types of CVD-grown FG led to a constant value of the resistivity or to an irreversible increase in the resistivity under repeated strain cycles. FG films created from the suspension of the fluorinated graphene with a fluorination degree of 20–25%, after the exclusion of design details of the used structures, demonstrated a stable resistivity at least up to 2–3% of tensile and compressive strain. The scale of resistance changes ΔR/R0 was found to be in the range of 14–28% with a different sign at the 10% tensile strain (bending radius 1 mm). In the case of the structures with the FG thin film printed on polyvinyl alcohol, a stable bipolar resistive switching was observed up to 6.5% of the tensile strain (bending radius was 2 mm). A further increase in strain (6.5–8%) leads to a decrease in ON/OFF current ratio from 5 down to 2 orders of magnitude. The current ratio decrease is connected with an increase under the tensile strain in distances between conductive agents (graphene islands and traps at the interface with polyvinyl alcohol) and thickness of fluorinated barriers within the active layer. The excellent performance of the crossbar memristor structures under tensile strain shows that the FG films and structures created from suspension are especially promising for flexible electronics.
机译:研究了含氟石墨烯(FG)薄片和化学气相沉积(CVD)生长的石墨的不同薄膜和结构在弯曲变形引起的拉伸和压缩应变下的电阻率。通过化学气相沉积(CVD)方法生长的石墨烯和多层石墨烯膜通过层压转移到柔性基板上并进行氟化。他们表现出较弱的氟化度(F / C降低20%)。在这两种情况下,压缩应变均导致电阻率大幅下降(一两个数量级),这很可能与通过氟化石墨烯形成的其他导电路径有关。两种类型的CVD生长的FG弯曲引起的拉伸应变高达3%,导致电阻率的值恒定或在重复应变循环下电阻率不可逆地增加。在排除所用结构的设计细节之后,由氟化度为20%至25%的氟化石墨烯的悬浮液制成的FG膜表现出稳定的电阻率,至少拉伸和压缩应变的2-3%。电阻变化的比例ΔR/ R0被发现在14%到28%的范围内,在10%的拉伸应变下(弯曲半径1 mm),其符号不同。对于在聚乙烯醇上印刷有FG薄膜的结构,观察到高达6.5%的拉伸应变(弯曲半径为2 mm)时,稳定的双极电阻转换。应变的进一步增加(6.5–8%)导致开/关电流比从5降低到2个数量级。电流比的降低与在拉伸应变下导电剂之间的距离(与聚乙烯醇的界面处的石墨烯岛和阱)和活性层内氟化阻挡层的厚度增加有关。纵横制忆阻器结构在拉伸应变下的出色性能表明,由悬架制成的FG薄膜和结构对于柔性电子产品尤其有希望。

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