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One-Step Mask Etching Strategy Toward Ordered Ferroelectric Pb(Zr0.52Ti0.48)O3 Nanodot Arrays

机译:有序铁电Pb(Zr0.52Ti0.48)O3纳米点阵列的一步掩模刻蚀策略

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摘要

In this report, ordered lead zirconate titanate Pb(Zr0.52Ti0.48)O3 (PZT) nanodot arrays were fabricated by an original one-step mask etching route. The one-step mask etching strategy is based on the patterned nanostructure of barrier layer (BL) at the bottom of anodic aluminum oxide (AAO), by a direct transfer of the nanopattern from BL to the pre-deposited PZT film, without introduction of any sacrifice layer and lithography. Therefore, the presented strategy is relatively simple and economical. X-ray diffraction and Raman analysis revealed that the as-prepared PZT was in a perovskite phase. Atomic and piezoresponse force microscopy indicated that the PZT nanodot arrays were with both good ordering and well-defined ferroelectric properties. Considering its universality on diverse substrates, the present method is a general approach to the high-quality ordered ferroelectric nanodot arrays, which is promising for applications in ultra-high density nonvolatile ferroelectric random access memories (NV-FRAM).
机译:在此报告中,有序的锆钛酸铅钛酸铅Pb(Zr0.52Ti0.48)O3(PZT)纳米点阵列是通过原始的一步掩模蚀刻工艺制造的。一步式掩模蚀刻策略基于阳极氧化铝(AAO)底部的势垒层(BL)的图案化纳米结构,通过将纳米图案从BL直接转移到预沉积的PZT膜而无需引入任何牺牲层和光刻。因此,所提出的策略相对简单且经济。 X射线衍射和拉曼分析表明,所制备的PZT处于钙钛矿相。原子和压电响应力显微镜表明,PZT纳米点阵列具有良好的有序性和明确的铁电性能。考虑到其在各种基板上的通用性,本方法是高质量有序铁电纳米点阵列的通用方法,有望用于超高密度非易失性铁电随机存取存储器(NV-FRAM)。

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