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Modifying the thermal conductivity of small molecule organic semiconductor thin films with metal nanoparticles

机译:用金属纳米粒子修饰小分子有机半导体薄膜的热导率

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摘要

Thermal properties of organic semiconductors play a significant role in the performance and lifetime of organic electronic devices, especially for scaled-up large area applications. Here we employ silver nanoparticles (Ag NPs) to modify the thermal conductivity of the small molecule organic semiconductor, dinaphtho[2,3-b:2’,3’-f]thieno[3,2-b]thiophene (DNTT). The differential 3-ω method was used to measure the thermal conductivity of Ag-DNTT hybrid thin films. We find that the thermal conductivity of pure DNTT thin films do not vary with the deposition temperature over a range spanning 24 °C to 80 °C. The thermal conductivity of the Ag-DNTT hybrid thin film initially decreases and then increases when the Ag volume fraction increases from 0% to 32%. By applying the effective medium approximation to fit the experimental results of thermal conductivity, the extracted thermal boundary resistance of the Ag-DNTT interface is 1.14 ± 0.98 × 10−7 m2-K/W. Finite element simulations of thermal conductivity for realistic film morphologies show good agreement with experimental results and effective medium approximations.
机译:有机半导体的热特性在有机电子设备的性能和寿命中起着重要作用,尤其是在按比例放大的大面积应用中。在这里,我们采用银纳米颗粒(Ag NPs)来修饰小分子有机半导体,即萘并[2,3-b:2’,3’-f] thieno [3,2-b]噻吩(DNTT)的热导率。用差分3-ω法测量Ag-DNTT杂化薄膜的热导率。我们发现,纯DNTT薄膜的热导率在24 C至80 C范围内不会随沉积温度而变化。当Ag的体积分数从0%增加到32%时,Ag-DNTT杂化薄膜的热导率首先降低,然后增加。通过应用有效介质近似法拟合导热系数的实验结果,提取的Ag-DNTT界面的热边界电阻为1.14±0.98×10 −7 m 2 -K / W。逼真的薄膜形态的热导率有限元模拟显示与实验结果和有效的介质近似值吻合良好。

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