embedded image ;Embodiments of the present disclosure include the thin film, a manufacturing method for the thin film using the composition for depositing the thin film, and a semiconductor device including the thin film."/> ORGANIC METAL COMPOUND, COMPOSITION FOR DEPOSITING THIN FILM COMPRISING THE ORGANIC METAL COMPOUND, MANUFACTURING METHOD FOR THIN FILM USING THE COMPOSITION, THIN FILM MANUFACTURED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE INCLUDING THE THIN FILM
首页> 外国专利> ORGANIC METAL COMPOUND, COMPOSITION FOR DEPOSITING THIN FILM COMPRISING THE ORGANIC METAL COMPOUND, MANUFACTURING METHOD FOR THIN FILM USING THE COMPOSITION, THIN FILM MANUFACTURED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE INCLUDING THE THIN FILM

ORGANIC METAL COMPOUND, COMPOSITION FOR DEPOSITING THIN FILM COMPRISING THE ORGANIC METAL COMPOUND, MANUFACTURING METHOD FOR THIN FILM USING THE COMPOSITION, THIN FILM MANUFACTURED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE INCLUDING THE THIN FILM

机译:有机金属化合物,用于沉积薄膜的组合物,所述薄膜包含有机金属化合物,使用该组合物的制造方法,由组合物制造的薄膜,以及包括薄膜的半导体器件

摘要

An organometallic compound represented by Chemical Formula 1 may be used in a composition for depositing a thin film including the organometallic compound, where A is derived from a compound represented by Chemical Formula 2:; embedded image ;Embodiments of the present disclosure include the thin film, a manufacturing method for the thin film using the composition for depositing the thin film, and a semiconductor device including the thin film.
机译:由化学式1表示的有机金属化合物可用于用于沉积包括有机金属化合物的薄膜的组合物中,其中A衍生自化学式2表示的化合物: <化学ID =“Chem-US-00001”> “嵌入图像”文件=“US20210193459A1-20210624-C00001.gif”他=“58.76mm”IMGContent ;本公开的实施例包括薄膜,使用用于沉积薄膜的组合物的薄膜的制造方法,以及包括薄膜的半导体器件。

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