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Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics

机译:具有常关特性的反相沟道金刚石金属氧化物半导体场效应晶体管

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摘要

We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm2/Vs, respectively, at room temperature.
机译:我们制造了具有常关特性的反向沟道金刚石金属氧化物半导体场效应晶体管(MOSFET)。目前,由于具有高可控性和高耐受性,具有反相沟道的Si MOSFET和绝缘栅双极型晶体管(IGBT)广泛使用。尽管金刚石半导体被认为是具有强大潜力的下一代功率器件应用材料,但尚未报道具有反向沟道的金刚石MOSFET。我们通过湿退火精确控制了金刚石的MOS接口,并在金刚石(111)衬底上制造了带有磷掺杂n型体的p沟道和平面型MOSFET。通过在300°C的原子层沉积,将Al2O3的栅极氧化物沉积到n型金刚石主体上。漏极电流由负栅极电压控制,表明在高质量的n型金刚石体/ Al2O3界面上形成了具有p型特征的反向沟道。室温下,栅电极长度为5μm的金刚石MOSFET的最大漏极电流密度和场效应迁移率分别为1.6μmA/ mm和8.0μcm 2 / Vs。

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