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Direct Detection of Akhiezer Damping in a Silicon MEMS Resonator

机译:直接检测硅MEMS谐振器中的Akhiezer阻尼

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摘要

Silicon Microelectromechanical Systems (MEMS) resonators have broad commercial applications for timing and inertial sensing. However, the performance of MEMS resonators is constrained by dissipation mechanisms, some of which are easily detected and well-understood, but some of which have never been directly observed. In this work, we present measurements of the quality factor, Q, for a family of single crystal silicon Lamé-mode resonators as a function of temperature, from 80–300 K. By comparing these Q measurements on resonators with variations in design, dimensions, and anchors, we have been able to show that gas damping, thermoelastic dissipation, and anchor damping are not significant dissipation mechanisms for these resonators. The measured f · Q product for these devices approaches 2 × 1013, which is consistent with the expected range for Akhiezer damping, and the dependence of Q on temperature and geometry is consistent with expectations for Akhiezer damping. These results thus provide the first clear, direct detection of Akhiezer dissipation in a MEMS resonator, which is widely considered to be the ultimate limit to Q in silicon MEMS devices.
机译:硅微机电系统(MEMS)谐振器在定时和惯性检测方面具有广泛的商业应用。但是,MEMS谐振器的性能受到耗散机制的限制,其中一些容易检测且易于理解,但其中一些从未被直接观察到。在这项工作中,我们介绍了单晶硅Lamé模式谐振器系列的品质因数Q随温度的变化,从80-300 K.通过比较这些谐振器的Q测量值在设计,尺寸上的变化,我们已经证明,对于这些谐振器,气体阻尼,热弹性耗散和锚固阻尼并不是重要的耗散机制。这些设备测得的f·productQ乘积接近2×10 13 ,与Akhiezer阻尼的预期范围一致,并且Q对温度和几何形状的依赖性与Akhiezer阻尼的期望一致。因此,这些结果提供了对MEMS谐振器中Akhiezer耗散的第一个清晰,直接的检测,这被广泛认为是硅MEMS器件中Q的最终极限。

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