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One-step growth of thin film SnS with large grains using MOCVD

机译:利用MOCVD一步法生长大晶粒薄膜SnS

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摘要

Thin film tin sulphide (SnS) films were produced with grain sizes greater than 1 μm using a one-step metal organic chemical vapour deposition process. Tin–doped indium oxide (ITO) was used as the substrate, having a similar work function to molybdenum typically used as the back contact, but with potential use of its transparency for bifacial illumination. Tetraethyltin and ditertiarybutylsulphide were used as precursors with process temperatures 430–470 °C to promote film growth with large grains. The film stoichiometry was controlled by varying the precursor partial pressure ratios and characterised with energy dispersive X-ray spectroscopy to optimise the SnS composition. X-ray diffraction and Raman spectroscopy were used to determine the phases that were present in the film and revealed that small amounts of ottemannite Sn2S3 was present when SnS was deposited on to the ITO using optimised growth parameters. Interaction at the SnS/ITO interface to form Sn2S3 was deduced to have resulted for all growth conditions.
机译:薄膜硫化锡(SnS)薄膜采用一步金属有机化学气相沉积工艺生产,晶粒尺寸大于1μm。掺锡的氧化铟(ITO)被用作衬底,其功函数与通常用作背接触的钼相似,但潜在地将其透明性用于双面照明。四乙基锡和二叔丁基硫醚被用作前体,工艺温度为430–470°C,以促进大晶粒薄膜的生长。通过改变前驱物的分压比来控制薄膜的化学计量,并通过能量色散X射线光谱进行表征,以优化SnS的组成。 X射线衍射和拉曼光谱法用于确定膜中存在的相,并显示使用优化的生长参数将SnS沉积到ITO上时,会存在少量的菱锰矿Sn2S3。据推测,在所有生长条件下,SnS / ITO界面上的相互作用形成了Sn2S3。

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