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Effective Reduction of Volumetric Thermal Expansion of Aromatic Polyimide Films by Incorporating Interchain Crosslinking

机译:通过结合链间交联有效降低芳香族聚酰亚胺薄膜的体积热膨胀

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摘要

To develop a facile method for reducing the coefficient of volumetric thermal expansion (CVE) of polymer films, the thermal expansion behaviors of thermally cross-linkable polyimide (PI) films with isomeric diamine structures were investigated via thermal mechanical analyses and optical interferometry measurements. The degree of crosslinking of the PI films containing the diphenylethynylene (Ph–C≡C–Ph) structure in the main chain was characterized by far-infrared (far-IR) spectra and density functional theory (DFT) calculations, and variations in the CVE induced by thermal crosslinking were quantitatively estimated. The crosslinking reactions effectively reduced the CVEs of the PI films by suppressing intermolecular free volume expansion and local molecular motions promoted at elevated temperatures. The lowest CVE value observed for a crosslinked PI cured at 400 °C (+98 ppm/K at 80–280 °C) was one of the smallest values reported to date in polymers. Incorporating interchain crosslinking into the main chain is an effective method for reducing the CVE of aromatic polymers.
机译:为了开发一种减少聚合物膜的体积热膨胀系数(CVE)的简便方法,通过热力学分析和光学干涉测量方法研究了具有同构二胺结构的可热交联聚酰亚胺(PI)膜的热膨胀行为。主链上包含二苯乙炔基(Ph–C≡C–Ph)结构的PI膜的交联度通过远红外(far-IR)光谱和密度泛函理论(DFT)计算以及定量估计了由热交联引起的CVE。交联反应通过抑制分子间自由体积膨胀和在高温下促进的局部分子运动,有效降低了PI膜的CVE。在400°C下固化的交联PI观察到的最低CVE值(在80-280°C下为+98 ppm / K)是迄今为止报道的聚合物中的最小值之一。将链间交联引入主链是降低芳族聚合物CVE的有效方法。

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