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Thermochemical Stability and Friction Properties of Soft Organosilica Networks for Solid Lubrication

机译:固体润滑的软有机硅网络的热化学稳定性和摩擦性能

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摘要

In view of their possible application as high temperature solid lubricants, the tribological and thermochemical properties of several organosilica networks were investigated over a range of temperatures between 25 and 580 °C. Organosilica networks, obtained from monomers with terminal and bridging organic groups, were synthesized by a sol-gel process. The influence of carbon content, crosslink density, rotational freedom of incorporated hydrocarbon groups, and network connectivity on the high temperature friction properties of the polymer was studied for condensed materials from silicon alkoxide precursors with terminating organic groups, i.e., methyltrimethoxysilane, propyltrimethoxysilane, diisopropyldimethoxysilane, cyclohexyltrimethoxysilane, phenyltrimethoxysilane and 4-biphenylyltriethoxysilane networks, as well as precursors with organic bridging groups between Si centers, i.e., 1,4-bis(triethoxysilyl)benzene and 4,4′-bis(triethoxysilyl)-1,1′-biphenyl. Pin-on-disc measurements were performed using all selected solid lubricants. It was found that materials obtained from phenyltrimethoxysilane and cyclohexyltrimethoxysilane precursors showed softening above 120 °C and performed best in terms of friction reduction, reaching friction coefficients as low as 0.01. This value is lower than that of graphite films (0.050 ± 0.005), a common bench mark for solid lubricants.
机译:考虑到它们可能用作高温固体润滑剂,在25至580°C的温度范围内研究了几种有机硅网络的摩擦学和热化学性质。由具有末端和桥连有机基团的单体获得的有机硅网络是通过溶胶-凝胶法合成的。研究了碳烷氧基硅前体与端基有机基团(即甲基三甲氧基硅烷,丙基三甲氧基硅烷,二异丙基二甲氧基硅烷)的缩合材料的碳含量,交联密度,结合的烃基旋转自由度和网络连接性对聚合物高温摩擦性能的影响。环己基三甲氧基硅烷,苯基三甲氧基硅烷和4-联苯基三乙氧基硅烷网络,以及在Si中心之间具有有机桥基的前体,即1,4-双(三乙氧基甲硅烷基)苯和4,4'-双(三乙氧基甲硅烷基)-1,1'-联苯。使用所有选定的固体润滑剂进行针式盘式测量。已经发现,由苯基三甲氧基硅烷和环己基三甲氧基硅烷前体获得的材料在120℃以上显示出软化并且在减少摩擦方面表现最佳,达到低至0.01的摩擦系数。该值低于石墨膜(0.050±0.005)的值,后者是固体润滑剂的常见基准。

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