金刚石表面化学镀铜工艺的优化

摘要

Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 °C, pH=13 and stirring at (350±15) r/min under ultrasonication.%研究预镀1%铬金刚石颗粒表面化学镀铜的预处理工艺、镀液成分和工艺参数对表面形貌、沉积效率、镀层均匀性等的影响，优化出最佳工艺参数。结果表明，采用20%NaOH溶液处理30 min后，再在SnCl2溶液中进行5 min敏化和在PbCl2溶液中进行20 min活化，能提高预镀1%铬金刚石颗粒表面镀铜质量，并获得较高的铜沉积率。化学镀铜最佳工艺条件为：16 g/L CuSO4·5H2O，35 mL/L甲醛，23 g/L酒石酸钾钠，温度60°C，pH=13，辅助超声加(350±15) r/min的机械搅拌。采用此工艺在预镀1%铬金刚石颗粒表面获得了厚度均匀的纯铜层。