Interpenetrating Microstructure of Diamond-Copper Composites Obtained by Electroless Copper Deposition on Diamond Powder

摘要

This paper reports on the possibility of obtaining high thermal conductive diamond-copper composites with interpenetrating structure through sintering of diamond powder coated by copper via electroless plating method. Two types of synthetic diamond powder with different grain size were consolidated via High Pressure High Temperature (HPHT) and Pulse Plasma Sintering (PPS) . The HRSEM and TEM microscopy have been used for investigations of microstructure and diamond-copper interphase boundary. In order to determine the influence of applied sintering technique as well as grain size of diamond for thermal properties of the prepared composites the Laser Flash Analysis was used. Obtained results indicate that utilization of electroless plating of diamond powder before sintering process allows for obtaining uniformly interpenetrating structure. In case of sintering coarse grain powder with HPHT method obtained composite exhibits the best thermal conductivity (about 500 W·m~(-1) ·K~(-1) at room temperature).