The device of passive heat removal of the processor of the mobile device or the portable computer on the basis of diamond-copper composite material

摘要

Use: to cool the heat-stressed components of electronic devices. The essence of the utility model is that the passive heat sink device of the mobile device or laptop computer processor contains a processor on the motherboard that is installed on the motherboard via a contact on the textolite substrate of the processor, the connector pins are fixed to the board with solder, the processor socket can have processor fixing elements, in the case of a processor of a mobile device or a laptop computer, a vent is made, the device is provided with a plate of heat removal of diamond-copper composite material, made with a width equal to or greater than the width of the top of the processor with a length²⋅K) up to 900 W / (m²⋅K), the coaxial technological holes for fastening are made on the motherboard and on the plate of the heat sink from the diamond-copper composite material, the plate of the heat sink from the diamond-copper composite material is fixed in such a way that one end of the plate is tightly pressed to the top of the processor and the second end the plate enters the vent in the processor casing of the mobile device or the laptop computer by half the width of the casing to prevent the user from contacting the heated end of the plate t plootvoda, to place the contact housing with the heat sink plate coated epoxy or silicone compound to provide a sealing enclosure of the mobile device processor or a laptop computer. The technical result: providing an opportunity to improve the efficiency of the cooling system. 1 z.s. f-ly, 3 ill. The device is characterized in that the thermal contact of the heat sink plate and the upper part of the central processor is provided by polishing the contacting surface of the heat-pipe plate with their subsequent mechanical pressing, or by applying, in the thermal contact zone of the heat-conducting paste, for example, Coollaboratory Liquid PRO. The device is characterized in that the heat sink plate enters a rectangular vent hole in the body of the mobile device or a laptop computer half its width, to prevent the user from contacting the heated end of the heat sink plate. The device is also characterized in that an epoxy or silicone compound is applied to secure the housing of the mobile device or the laptop computer to the place of its contact with the heat sink plate. 5 p., 1 bp, 3 ill.