METHOD FOR PROVIDING PASSIVE HEAT RECEPTOR OF MOBILE DEVICE PROCESSING UNIT OR LAPTOP COMPUTER BASED ON DIAMOND-COPPER COMPOSITE MATERIAL AND DEVICE FOR ITS IMPLEMENTATION

摘要

FIELD: electronic equipment.;SUBSTANCE: invention relates to the field of electronics, in particular to cooling of heat-stressed components of electronic devices, including gadgets (iPhone, iPad, tablet, etc. mobile devices) and computers, and can be used to provide efficient heat removal from heat-stressed integrated microcircuit of PU, installed on motherboard of mobile device or laptop computer. For this matter, method comprises PU on motherboard of mobile device or laptop computer, which is installed on board by means of connector through contact textolite PU substrate, contacts of connector are fixed on board with solder, PU socket can have elements for fixing PU, characterized in that casing of mobile device or laptop has vent hole, insert heat sink plate from diamond-copper composite material, made with geometric dimensions, which are due to width of more or equal to width of PU upper part, as for length – distance from far edge of upper part of CPU to vent in casing of mobile device or laptop computer plus half width of mobile device or laptop casing, while in case of removing more heat energy from PU, diamond-copper composite is selected with necessary coefficient of thermal conductivity from 600 W/(m²⋅K) up to 900 W/(m²⋅K) and by varying width, height and length of heat sink plate.;EFFECT: technical result consists in ensuring casing sealing of mobile device or laptop computer.;6 cl, 3 dwg