The solder of Ti-50Cu-5Nb (mass fraction) was prepared by vacuum arc melting. The melting temperature range of the solders confirmed by the Differential Scanning Calorimeter (DSC) was 980 ~ 1 050℃. The compositions of the solder were Cu3Ti2 and CuTi2, and the niobium was existed in titanium-copper alloy as solid solution, studied by Energy Dispersive Spectrometer (EDS) and X-ray Diffraction (XRD). The change of the wetting angles was investigated by an improved sessile drop technique at the temperature of 1 000, 1 050 and 1 100℃ , and the results show that the solder provides outstanding wetting on the substrate. The primary product TiSi accelerated the wetting on the interface between the titanium alloy and SiC.%采用真空电弧熔炼法制备Ti-50Cu-5Nb(质量分数)合金钎料.根据DSC曲线确定出合金钎料的熔化温度为980 ～1 050℃;通过能谱(EDS)和X射线衍射(XRD)分析得出钎料化学组成主要为Cu3Ti2和CuTi2,Nb元素以固溶体的形式存在于钛铜合金中;通过改良后的座滴法研究了钎料在1 000、1 050和1 100℃下润湿角度的变化情况.实验表明在高温下钎料对基体均有很好的润湿作用;在钎料与SiC基体反应界面,主要生成物TiSi促进了润湿过程的进行.
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