[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[1]State Key Laboratory of Digital Manufacturing Equipment and Technology;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
[2]Flexible Electronics Research Center;
Huazhong University of Science and Technology;
Wuhan 430074;
China;
laser lift-off; interfacial peeling; delamination; flexible electronics; thin film;