片式减成法30μm/25μm(线宽/间距)COF精细线路的制作

摘要

随着晶片封装技术的不断发展,要求基板线路的精细度越来越高,50 μm/50μm以下的COF(Chip on Flex)精细线路将成为未来发展的主流,但精细线路的制作一直是FPC生产上的难点,当线路在5 0μm/50μm以下时,成品率较低难以满足量产化的要求.本文中以公司的现有设备为基础,通过传统片式生产线,选用12 μm铜箔作为基材、15 μm干膜作为抗蚀层,使用玻璃菲林进行图形转移,同时通过表面处理、改变曝光、显影和蚀刻参数等,对30 μm/25 μm的精细线路进行研制,并通过金相切片测试仪、三次元测试仪、AOI(Automatic Optical Inspector)等对产品进行检查.结果显示,线宽、蚀刻系数和成品率都能达到小批量生产的要求.%With the development of chip seal technology and the higher request for the fine degree of fineness of plate line,the fine line below 50μm/50μm micron will become the mainstream in the future development.But the fine line production has always been the difficulty in the production of FPC.When the line belows 50μm/500μm,the rate of finished products will be low and it is difficult to satisfy the request of production.In this paper,we use company's existing equipments,by the traditional piece type production line,select the 12μm-copper foil as the fine line parent metal,take the 15μm dry film as the anti-eclipse level and carry on the graph shift with lass Philippines,at the same time,simultaneously,we product 30μm/25μm fine line with surface treatment,light,etching parameter and other methods.