沉铜背光不良问题的改善

摘要

主要介绍了一直困扰印制电路沉铜生产工艺过程中频繁出现的背光不良问题的追踪改善情况,通过深入研究和探索,找到了问题的产生根源,制定了有效的改善措施,最终杜绝了背光不良问题的发生,稳定了沉铜工序的生产。%This article introduced a problem about the PTH defect which had been traced and improved in PTH process.We found the problems source through into exploration,and worked out effective improvement step.Finally,we avoid PTH defect,stabilized PCB production in PTH process.