选择性化学镍金板贾凡尼效应改善

摘要

Galvanic effect has been discussed many times in PCB.According to the real process and by using galvanic cell theory,this article summarized a method to solve the BGA Pad size reduction and hole edge breaks problem.%贾凡尼效应在PCB业界已讨论过很多,本文从实际生产选择性化金板工艺流程出发,应用原电池理论,总结出一套解决因为贾凡尼效应而产生BGA焊盘缩小、孔口无铜等缺陷的方法。