随电子产品的功率增加、密度提高、可靠性要求提升以及无铅装配的盛行,PCB厂家及PCBA日益关注基材的耐热特性,而这些耐热特性是通过热分析手段进行检测的。本文结合生产实际情况,阐述了CCL与PCB基材的几种热分析技术指标,并剖析了二者在Tg（玻璃化温度）、Td（热裂解温度）、T260/T288（热分层时间）、Z-CTE（热膨胀系数）方面的区别与关联,希望能对大家正确地选择材料、衡量材料特性并解决PCBA对板材方面的疑惑提供些许帮助。%Demands for higher power, higher density, higher reliability and lead-free assemble are notable today in electronic field, the PCB and PCBA manufacturers are taking a closer look at the heat-resistant and reliability of the base material which are tested by thermal analysis. This article is intended to introduce some parameters for thermal analysis such as glass transition temperature （Tg）, thermal decomposition temperature （Td）, delamination time （T260/T288/T300） and Z-axis thermal expansion （Z-CTE） and whose differences between CCL.and PCB. The purposes of this study are to help to understand correctly the basic characteristics for PCB manufacturers and resolve the doubts for PCBA manufacturers for the base material.
展开▼
