随着盲孔在板件中的应用越来越广泛，传统垂直电镀线在加工纵横比高的盲孔上遇到一些困难，电镀工序出现盲孔与通孔无法同时兼顾的情况。文章从电镀流程中的电流密度、无机药水成分、电镀添加剂比例、搅拌方式等方面着手，通过实验验证的方式讨论了影响垂直电镀线盲孔深镀能力的一些因素，确认最佳电镀条件并应用于实际生产线中，使生产线盲孔深镀能力得到较大能力提升，能获得100%以上的盲孔深镀能力，使得盲孔有接近电镀填孔的效果。%As more and more blind micro via is applied on printed circuit board and the diameter of blind micro via become smaller, the copper clad thickness of blind micro via with high aspect ratio is not enough which is plated on the tradition vertical plating line. This article introduces some influence factors, for example electric current, inorganic chemistry, additive, air or educator, etc. It also introduces the best plating parameter that make semi-fill via in the process.
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