叠孔类多阶HDI板制作难点探讨

摘要

以一款16层的叠孔三阶HDI板的制作为例，讲述该类产品的制作难点、控制重点和注意事项等，为同行技术工作者制作该类产品提供参考。%Taking a 16 layer of 3-stacked via HDI board production as an example, this paper describes the production difficulties, key control points and matters requiring attention for the peer and technical workers. It is hoped to provide certain reference for production of the products.