关于二阶激光孔钻孔加工技术的研究与应用

摘要

激光钻孔加工技术的产生与飞速发展是PCB行业技术发展的显著标志，是PCB钻孔技术发展的革命。目前业界激光钻孔加工普遍使用CO2激光钻孔机，由于CO2激光能量受脉冲周期、脉冲波形、脉冲宽度、PCB表面处理工艺、激光孔的类别/结构等因素的影响，孔底树脂残留、孔形异常、孔底铜箔击穿、孔壁玻璃丝布突起等一系列品质问题随之而来，这其中，以“击穿爆孔”问题最为突出、危害最大。本文主要针对击穿爆孔的问题展开技术研究与改善。%Laser drilling and processing technology in production and their rapid development is the signiifcant symbol of technology development of PCB industry, which is the development of PCB drilling technology revolution. At present, the industry generally use CO2 laser drilling. As the CO2 of laser energy is affected by pulse period, pulse waveform, pulse width, PCB surface treatment and laser hole category/structure, and other factors, the defects such as the bottom of the hole resin residues, hole shape abnormality, hole bottom copper foil breakdown and the hole wall of glass cloth protrusions etc. come up, in which, the breakdown hole is the most prominent, and has the biggest harm. This paper mainly aimed at the breakdown hole defect research and improvement.