树脂塞孔工艺中，经常遇到由于板面凹凸不平导致树脂固化后难以打磨的情形。为去除板面凹处树脂，反复多次磨板极易导致板面露基材；手动打磨，费时费力并且效率低。为此，本文采用在板面贴干膜的方法进行选择性树脂塞孔。研究了高温烘烤对干膜物理和褪膜性能的影响，探讨了树脂与干膜表面的作用机理，明确了磨板过程对后续褪膜的影响。实验结果表明：通过贴干膜可以有效保护板面粘上多余的树脂，高温烘烤对干膜本身褪膜性能没有明显影响，高温固化时干膜与树脂的接触面发生了一定程度的共混和化学反应，磨板时必须将干膜表面的残留树脂层以及干膜与树脂接触面的共混层都去除干净，才能保证后续褪膜的顺利进行。%It was often encountered situation which the board was dififcult to be scrubbed cleanly after the resin curing , as the board surface was not lfat. To remove recess resin, it easily led to board exposuring substrate if grinded repeatedly;and it was even time-consuming and inefifcient if taken manual grinding. To this end, this paper studied that through posting dry film on the board to protected the copper surface which didn’t need to resin plugging, researched the effects of high temperature baking to the physical and stripping properties of dry iflm, discussed the mechanism of resin and dry iflm, found the inlfuence of grinding on the subsequent stripping. The results showed that:the board could be effectively protected by dry iflm to glue excess resin, there was no signiifcant effect on the stripping properties of dry iflm through the high temperature curing, the dry iflm surface and resin occurred a degree of chemical reactions and blend. The dry iflm could be stripped clearly if the residual resin layer and the reaction layer were removed.
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