50mm/50mm精细线路制作探讨

摘要

As the future of 3G/4G like mobile phones and digital cameras products of light and thin, miniaturization and muti-function change development trend, line level of refinement gradually turned to the microcosmic, microscopic level of micron scale, line also greatly improved the precision requirements. In this article, through the typical third-order three clamp of the production process, from material selection, equipment selection, line resolution, etching uniformity control, uniformity of surface copper control, circuit aspects, etc., it discussed compensation including 50 mm/HDI board including 50 mm ifne lines best method of making, production has a certain reference value for ifne lines.%随着未来手机及数码相机等3G/4G产品的轻、薄、小型化与多功能化发展趋势，线路的精细化程度逐步转向亚微观、微观的微米级尺度，线路的精密要求也大大提高。文章通过典型的三阶三压板的制作过程，从物料选择、设备选择、线路解析度、蚀刻均匀性控制、面铜均匀性控制、线路补偿等方面探讨50mm/50mm精细线路HDI板最佳制作方法，对细线路的制作有一定的参考价值。