化学镀研究现状及发展趋势

摘要

As a fine surface treatment technology, electroless plating can yield uniform deposits on surface of conductor and non-conductive material, and the operation is easy, so it has been got great attention by industry and academia. In this paper, current research status of electroless plating and applications of main electroless plating coating such as Ni,Cu,Co,Ag,Sn,Au and Pd electroless coatings are reviewed, development trends of electroless plating is also indicated.%化学镀作为一种优良的表面处理技术,能够施镀于导体和非导体材料,镀层均匀,操作简便,因此一直受到工业上和学术界的关注.综述了化学镀的研究现状和主要化学镀层的应用领域,包括化学镀镍、化学镀铜、化学镀钴、化学镀银、化学镀锡、化学镀金以及化学镀钯等技术,并提出了化学镀技术的发展趋势.