片状铜粉镀银及抗氧化性能研究

摘要

采用置换还原法在片状铜粉上镀银.对铜粉镀银制备过程及抗氧化性能做了研究.实验结果表明,在铜粉表面首先发生置换反应,生成点缀式银颗粒,之后银颗粒长大,不完全的包覆在铜粉表面,溶液中过量的银离子在还原剂的作用下,表面银层进一步生长,得到完全包覆银的铜粉.通过X-射线衍射分析,片状铜粉镀银层表面未见氧化物,所得粉末表层结构致密.铜粉镀银层具有良好的抗高温氧化性.%Flaky silver covered copper powder was prepared by displacement reaction.Preparation process and anti-oxidation property of the silver covered copper powder were studied.Experimental results showed that interspersed silver particles generated on the surface of copper powder by displacement reaction at first,and then the silver particles grew up and coated the copper powder incompletely.With excess silver ions in solution,silver layer grew further by reduction reaction and covered the copper powder completely.By XRD analysis,no oxide was detected on the surface of silver covered copper powder,the silver covered copper powder has dense surface structure and good high temperature oxidation resistance.