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Study on the Anti-oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

机译:各向同性导电粘合剂中铜粉涂层硅烷偶联剂抗氧化性能研究

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In this experiment, the micro copper powders with high temperature of oxidation resistance were prepared by coating with 2 wt.% of silane coupling agent(KH560) solution in order to protect them from oxidation in isotropically conductive adhesives, and X-ray diffraction analysis(XRD), thermo gravimetric analysis(TGA) and accelerated aging test were applied to analyze the anti-oxidant property of the samples before and after they were treated. Experimental results showed that the polymer of silane coupling agent on the surfaces of copper powders had high thermal stability exposed under high temperature and was very effective in preventing the copper powders from oxidation in isotropically conductive adhesives. Besides, the epoxy conductive adhesive sample with plated copper as electrically conductive fillers still had good conductive property even exposed at 160 degrees with its bulk resistivity was 8.75×10~(-3)Ω·cm.
机译:在该实验中,通过用2重量%的涂层制备具有高温抗氧化性的微铜粉末。硅烷偶联剂(KH560)溶液的%,以保护它们免受各向同性导电粘合剂中的氧化和X射线衍射分析( XRD),热重量分析(TGA)和加速老化试验用于分析在处理后和之后样品的抗氧化剂性能。实验结果表明,在高温下暴露在铜粉表面上的硅烷偶联剂的聚合物具有高热稳定性,并且非常有效地防止铜粉末在各向同性导电粘合剂中氧化。此外,具有电导电填料的具有电镀铜的环氧导电粘合剂样品仍然具有良好的导电性,甚至暴露于160度,其大量电阻率为8.75×10〜(3)Ω·cm。

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