基于封装结构温度传感器响应时间的分析

摘要

热电阻与热电偶是常用的测温元件。测量瞬态高温时，由于传感器自身的热惯性，测量结果与真实结果之间存在很大的动态误差，减小动态误差有重要意义。文中主要分析了热电阻与热电偶温度传感器的测温原理，以及封装结构对温度传感器响应时间的影响，并建立裸露敏感元件热传导温度的数学模型，从理论上分析影响温度传感器响应时间的主要因素，并对其加以改进达到实验所需要求。%Thermal resistance and thermocouple is a usual temperature measuring component. There are great dynamic errors between the measured results and the real signal for the thermal inertia of the transducer in transient high temperature measurement.So it is significant for decreasing the dynamic errors of the temperature measuring system. This article mainly analyses the difference of thermal resistance and thermocouple temperature sensor in the temperature measurement principle and the P ackaging structure of temperature sensor influencing response time.As well as built a mathematical model for the heat exchange temperature measure-ment with the bare sensitive element.The main factors affecting the response time of the temperature sensor are analyzed in theory ,and improved to meet the experiment requirements.