首页> 中文期刊> 《光学仪器》 >LED结温精密测量及相关因素分析

LED结温精密测量及相关因素分析

         

摘要

The impact of the measuring junction temperature with the change of three measurement factors,i.e.measuring current,heating current,heating time,was analyzed in the LED junction temperature precision measurement.The small current K-factor method is commonly used for the measurement of junction temperature.Experimental results showed that the junction temperature of lW LED gradually increased when the measuring current ranged from 0 mA to 30 mA,and when it exceeded 30 mA,the junction temperature would be stabilized;when the heating current changed from 100 mA to 400 mA,there existed an approximately linear relationship between junction temperature data and heating current.The result proves that,heating current had a linear modulation function for junction temperature.We also analyzed the relation between heating time and junction temperature simultaneously,with the conclusion that a certain heating time is required to obtain stability data in the measurement of LED junction temperature.%分析了LED结温精密测量中测量电流、加热电流、加热时间等三项测量因素的变化对所测结温的影响.实验采用小电流K系数法测试结温.实验结果表明:1W LED被测样品,当测量电流在0~30 mA时结温逐渐升高,当测量电流超过30 mA时结温趋于稳定;LED样品的结温数据与加热电流呈近似线性变化,表明能够通过加热电流对LED结温及相关光学性能实现线性调控.同时研究表明,结温精密测量还受到加热时间的影响,测得LED器件稳定的结温需要一定的加热时间.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号