ITER第一壁模块Be/Cu连接失效分析

摘要

ITER first wall mock-ups were fabricated by joining CuCrZr and 316L(N) stainless steel with explosion welding, machining cooling channel, and then bonding Be tiles on CuCrZr interface with a hot isostatic pressing (HIP) technology, but a few large scale defects on the Be/Cu joint interface were observed by ultrasonic testing. In order to guarantee the mock-up quality, destructive tests were performed on these failed mock-ups. Samples were observed with optical microscope and SEM, and the possible cause of the defects formation was identified preliminarily.%为了分析ITER第一壁模块试制过程中Be/Cu界面经热等静压扩散连接后出现的不可接受的大尺寸缺陷,对Be/Cu连接失效的模块进行了破坏性试验.首先采用线切割对模块进行解剖,并对连接界面缺陷区域及非缺陷区域通过金相观察、SEM观察及能谱分析进行对比,初步确定了界面连接的失效机理.