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Characterization of the CuCrZr alloy and the Cu/ss joints for ITER first wall

机译:ITER第一壁的CuCrZr合金和Cu / ss接头的表征

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As the ITER first wall material, Cu-alloy should satisfy the ITER specification for the material. The alloy would be influenced not only by thermo- mechanical process but also by the neutron radiation. It is thus necessary to study the effect of heat treatment on the microstructure and mechanical properties of the alloy. Besides, as a heat sink material, the alloy would be bond to a support back plate of 316LN steel in the FW panel. Mockups of Cu/ss joints have been fabricated by a hot isostatic pressing (HIP) process. The interface needs to characterize to understand the bonding mechanism. According to the material specification for the supply of CuCrZr-ITER Grade alloy plates for the ITER First Wall, CuCrZr alloy was prepared by vacuum melting. Ingots were then forged and hot-rolled to 13-18mm thick plate. Samples were cut from the plates. They were solid solution annealed at 960- 1040℃ for 30 minutes, followed by aging at 475℃ and 580℃. Tensile tests were conducted at RT and 250℃. The microstructure of the alloy were analyzed. Results showed the significant effect of the heat treatment on the microstructure and the tensile strength. For the Cu-SS joining, the HIPing method showed promising. Bonding strength was measured by tensile test at RT and the interface was observed by SEM. No defects at the interface were found by optical microscope and SEM observation. However, the grain of Cu-alloy in the vicinity of interface are inhomogeneous, fine grain near the interface but very large ones in the faraway area. EDS analysis shows the change of alloy element content and microstructure across the interface.
机译:作为ITER的第一壁材料,铜合金应满足ITER的材料规范。合金不仅会受到热机械过程的影响,还会受到中子辐射的影响。因此有必要研究热处理对合金的微观结构和力学性能的影响。此外,作为散热材料,该合金将粘结到FW面板中的316LN钢的支撑背板上。 Cu / ss接头的模型已通过热等静压(HIP)工艺制成。接口需要进行表征以了解绑定机制。根据用于ITER第一壁的CuCrZr-ITER级合金板供应的材料规格,通过真空熔融制备CuCrZr合金。然后将铸锭锻造并热轧至13-18mm厚的板。从板上切下样品。将它们在960-1040℃下固溶退火30分钟,然后在475℃和580℃下老化。在室温和250℃下进行拉伸试验。分析了合金的显微组织。结果表明热处理对显微组织和拉伸强度具有显着影响。对于Cu-SS连接,HIPing方法显示出良好的前景。通过在室温下的拉伸试验测量粘合强度,并且通过SEM观察界面。光学显微镜和SEM观察未发现界面缺陷。然而,在界面附近的铜合金晶粒是不均匀的,在界面附近是细晶粒,而在较远的区域则非常大。 EDS分析显示了整个界面中合金元素含量和显微组织的变化。

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