ATRP法合成(丙烯酸乙酯-co-3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷)共聚物及其性能研究

摘要

以单质铜 (Cu0) 为还原剂, 采用电子转移生成催化剂原子转移自由基聚合 (ARGET ATRP) 合成了丙烯酸乙酯-co-3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷 (DMMSPMA) 共聚物[P (EA-co-DMMSPMA) ]及其湿固化膜, 研究了P (EA-co-DMMSPMA) 分子量增加以及DMMSPMA含量对P (EA-co-DMMSPMA) 湿固化膜性能的影响.研究结果表明:随着P (EA-co-DMMSPMA) 分子量增大, 湿固化膜的拉伸强度增加, 断裂伸长率略有上升, 玻璃化转变温度升高.在P (EA-co-DMMSPMA) 分子量为10000, DMMSPMA含量为25％ (wt, 质量分数) 条件下, 其拉伸强度为2.09MPa, 断裂伸长率为33％, 玻璃化转变温度为4.18℃.%(Ethyl acrylate-co-3-methacryloyloxypropylmethyldimethoxysilane) copolymer[P (EA-co-DMMSPMA) ]and their moisture cured crosslinked films were synthesized via activators regenerated by electron transfer for atom transfer radical polymerization (ARGET ATRP) using copper (Cu0) as a reducing agent.The effects of increase in the molecular weight of P (EA-co-DMMSPMA) and the content of 3-methacryloyloxypropylmethyldimethoxysilane (DMMSPMA) on the properties of moisture cured crosslinked films were investigated.The results showed that with the increment of molecular weight of P (EA-co-DMMSPMA), the tensile strength of films increased, the elongation at break slightly increased, and the glass transition temperature increased.When the molecular weight of P (EA-co-DMMSPMA) was10000 and the content of DMMSPMA was 25 wt％ (wt, mass fraction), the tensile strength was 2.09 MPa, the elongation at break was 33％, and the glass transition temperatures was 4.18℃.