汽车电子产品及其封装材料的现状与发展方向

摘要

Development and application of electronic technology greatly improved the automotive functions and fea-tures. The fabrication of integrated circuit, protection for IC chip, signal transmission among semiconductor component, and even the final physical realizatibn for electronic product were carried by encapsulation. The automobile electronics in-dustry status and product features were summarized. The status of automobile electronics and encapsulation materials were introduced. In the end the key point how to develop automobile electronics with proprietary intellectual property rights was put forward.%电子技术的发展与应用极大地改善了汽车的功能和特征,其中封装承接了集成电路制作、IC芯片保护、元器件间的信号传递,并完成了电子产品的最终物理实现.本文综合当前汽车电子工业现状和产品特点,介绍了汽车电子封装材料的现状,最后提出了当前开发具有自主知识产权汽车电子产品的关键所在.