喷枪扫描速率对常压冷等离子喷涂Cu薄膜的影响

摘要

This work aims to study the effect of gun scanning rate on atmospheric cold plasma spraying of Cu film.N2 and NH3 mixed gas was used as the plasma gas source.The copper nitrate solution was atomized and passed into the downstream of the plasma jet.The atomization driving gas was N2 with a flow rate of 4 L/min,the shielding gas was Ar with a flow rate of 12 L/min. The chemical state of copper in the prepared copper film was analyzed by X-ray photoelectron spectroscopy.The microstructures of the prepared copper films were observed by scanning electron microscopy (SEM).The effects of the scanning rate on the spray gun were discussed.As the increasing scanning rate of the gun in the experimental range,the chemical state of the copper elements in the prepared film samples was changed from Cu2+ to Cu+ and then to Cu,and the grain size of the film was gradually reduced.In the spraying process,Cu(NO3 )2 in the plasma decomposition reaction would produce intermediates,NH3 in the plasma generated the ac-tive particles would react with the intermediate product and deposited to obtain Cu film.%研究了喷枪扫描速率对常压冷等离子喷涂Cu薄膜过程的影响.采用N2和NH3的混合气体作为等离子体气源产生常压冷等离子体,将Cu(NO3)2溶液雾化后通入等离子体射流的下游,雾化驱动气体是流量为4 L/min的N2,保护气体是流量为12 L/min的Ar,利用射流型常压冷等离子体喷涂Cu薄膜.通过X射线光电子能谱仪分析制备的铜薄膜中铜元素化学状态的变化,用扫描电子显微镜观察制备的铜薄膜的微观形貌,讨论了制备薄膜过程中喷枪扫描速率的作用和影响.以N2和NH3的混合气体作为等离子体气源喷涂Cu薄膜时,在实验范围内,随着喷枪扫描速率的增大,制备的薄膜样品中铜元素的化学状态从Cu2+变为Cu+,再变为Cu,且薄膜的晶粒尺寸逐渐减小.在喷涂过程中,Cu(NO3)2在等离子体中会发生分解反应,并产生中间产物,NH3在等离子体中产生的活性粒子会与中间产物反应沉积得到Cu薄膜.