关于环氧树脂粘接瓷绝缘件接口电击穿问题的探讨

摘要

通过对耐压检查过程的分析以及对粘接过程的模拟观察，确定了击穿的主要原因是接口胶层内存在气隙。根据所用环氧树脂粘接剂的粘度，适当提高粘接面的预热温度和粘接前粘接剂涂层的厚度，有利于粘接时封闭空气的排除，有利于减少气隙，从而减少击穿。同时证明，两瓷件接口面对接后，转动瓷件的作用是排胶。转动幅度不能过大，尽量不要使两接口面错开，以免再次产生气隙。%The article analyzes the withstanding voltage inspection process, and simulates the bonding process. The results show that the electric puncture is mainly caused by the gas gaps in the adhesive interface. According to the epoxy resin adhesive viscosity,the preheating temperature of the bonding surface and the thickness of the epoxy resin coating are improved to exclude the closed air and reduce the gas gaps,as to reduce the electric puncture. When two pieces of ceramic interface contact, the rotation range can not be too large,and can not make the two interface surfaces staggered,so as not to generate new gas gap.