铜离子印迹改性壳聚糖海绵的制备及应用研究

摘要

以醋酸铜为模板，甲醇、氯仿为溶剂，2-乙烯吡啶、丙烯酰胺为功能单体，乙二醇二甲基丙烯酸酯为交联剂，采用本体聚合法制备铜离子印迹聚合物；然后掺入到壳聚糖海绵的制备中，使壳聚糖海绵对铜离子的吸附率由27．1％提高到72．3％。制备的铜离子印迹改性壳聚糖海绵需要2d达到吸附平衡，吸附-解吸5次后，性能稳定。%using copper acetate as a template and methanol , chloroform as solvent , 2-vinylpyridine , acrylamide as functional monomer, ethylene glycol dimethacrylate as a crosslinking agent , a copper ion imprinted polymer (IIP) was prepared with bulk polymerization .Then the IIP was incorporated into the preparation of chitosan sponge , the adsorption rate of chitosan sponge in copper ion aqueous solution was developed from 27 .1%to 72 .3%.The IIP modified chitosan sponge reached equilibrium for 2 d .Results showed that stable performance was kept after ad-sorption -desorption 5 times .