微量铅对Sn-9Zn钎料组织及性能的影响

摘要

微量铅在目前的无铅工艺生产制程中广泛存在,并可对无铅钎料组织性能产生重要影响.运用X射线衍射仪、扫描电镜及电化学测试系统等仪器设备,研究微量铅对Sn-9Zn钎料组织性能影响.结果表明:当Pb质量分数为0.3％时,Sn-9Zn钎料中富Zn相明显细化,Pb固溶于钎料中；当Pb质量分数为0.8％时,钎料组织得到细化,Pb还以单质形式存在晶界处；钎料润湿性随Pb含量增加而得到改善,钎料显微硬度随Pb含量增加而增加,钎料腐蚀电位随Pb含量增加略有增大,但腐蚀电流密度却随Pb含量增加而明显减小.%Trace Pb existing in widespread lead -free soldering manufacturing Currently, may impact on microstructure and property of lead free solder. Effect of trace Pb on microstructure and property of Sn- 9Zn solder was investigated by means of XRD,SEM and electrochemical testing system etc. The results show that Zn-rich phase in Sn-9Zn solder significantly refine and Pb is solube in the solder at Pb content of 0. 3%; microstructure remarkablely is refine at Pb content of 0. 8%, and Pb precipitate in grain boundaries as well; wettability and microhardness of the solder increase with Pb content increasing, corrosion potential rise a little with Pb content increasing, however, corrosion current density decrease significantly with increasing Pb content.