Study on Cure Behavior of a Model Epoxy System by Means of TTT Diagram

摘要

Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper.Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model.The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0, gel Tgand Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.